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Brand Name : UNICOMP
Model Number : CX3000
Certification : CE, FDA
Place of Origin : China
MOQ : 1Set
Price : can negotiate
Payment Terms : T/T,L/C
Supply Ability : 30 sets per month
Delivery Time : 30 days
Packaging Details : Wooden Case, Waterproof, Anti-collision
Name : BGA X-Ray Inspection Machine
X-ray Coverage : 48mm x 54mm
Industry : Electronics Industry
Resolution : 208Lp/cm
X-ray Leakage : < 1uSv/h
Power Consumption : 0.5kW
Micro-focus x-ray cabinet systems BGA X-Ray Inspection Machine
Item | Definition | Specs |
System Parameters | Size | 750(L)x570(W)x890(H)mm |
Weight | 300kg | |
Power | 220AC/50Hz | |
Power Consumption | 0.5kW | |
X-ray Tube | Type | Closed |
Max.Voltage | 100kV | |
Max.Power | 200μA | |
Spot Size | 5μm | |
Detector | Intensifier | FPD |
X-ray Coverage | 48mm x 54mm | |
Resolution | 208Lp/cm | |
Work Station | Max.Loading Size | 200mm x 200mm |
Max.Inspection Area | 200mm x 200mm | |
Oblique Angle Views | 360° rotary fixture (Optional) | |
X-ray Leakage | <1μSv/h |
X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system.
Application:
1.BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient
2.QFN:Bridging,Voids,Opens,Registration
3.SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others
4.Semiconductor:
bond wire,die attach VOID ,MOLD,VOID
5.Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias
Inspection Images:
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High Efficient BGA X Ray Inspection Machine , Micro Focus X Ray Cabinet Systems Images |